1. Full-color inorganic LED using selective area growth and adhesive bonding

    In recent years, research into implementing microdisplays for use in virtual reality and augmented reality has been actively conducted worldwide. Specifically, inorganic light-emitting diodes (LED) have many advantages in microdisplays, so much effort has been made to implement them in various ways. However, it is still challenging to realize a display with high resolution using only inorganic LEDs without color conversion layers because a typical LED chip is designed to emit only one color on a single wafer. In this study, we integrated high-efficiency red, green, and blue (RGB) LED material systems on the same sapphire substrate.

2. Passive-matrix micro-LED array for display applications

    Many researches on micro-pixelated light-emitting diodes (micro-LEDs) are being carried out due to many advantages such as low power consumption, high pixel density, high contrast ratio and high refresh rates. Gallium nitride (GaN)-based micro-LEDs for micro-displays have been studied mainly for transfer micro-LEDs to integrated circuit (IC) chip for driving with an active-matrix display. In this study, we fabricated passive-matrix micro-LED array structure with a pixel size of 30 μm × 30 μm, pixel pitch of 20 μm and pixel per inch (PPI) of 509. Further, we focused on realizing dual-color passive-matrix micro-LEDs by adhesive bonding.

3. Current project

Development of Manufacturing Technology for High-Efficiency stacked Micro-LED Epi wafer

    Sponsor: Ministry of Trade, Industry and Energy (MOTIE)
    Project Leader: Soo-young Choi

50K nits 이상의 고휘도 초미세 화소용 광원 및 Frontplane 기술 개발

    Sponsor: Ministry of Trade, Industry and Energy (MOTIE)
    Project Leader: Jaeyoung Baik